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Indium Phosphide Wafer InP Semiconductor Substrates Epitaxial 2'' 3'' Thickness 350um Description of Indium Phosphide: Indium Phosphide (InP) chips are a widely used material in optoelectronics and semiconductor devices. It has the following advantages: High electron mobility: Indium phosphide chips have a high electron mobility, which means that electrons move faster through the material. Controlled material properties: The properties of indium
Indium Phosphide Wafer InP Semiconductor Substrates Epitaxial 2'' 3'' Thickness 350um Description of Indium Phosphide: Indium Phosphide (InP) chips are a widely used material in optoelectronics and semiconductor devices. It has the following advantages: High electron mobility: Indium phosphide chips have a high electron mobility, which means that electrons move faster through the material. Controlled material properties: The properties of indium more
Brand Name:ZMSH
Model Number:Indium Phosphide Wafer
Place of Origin:China
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...Indium Phosphide Wafer , 4”, Test Grade -InP Wafer Manufacturing PAM-XIAMEN provides single crystal InP(Indium phosphide) wafer for micro-electronic ( HBT/ HEMT ) and opto-electronic industry ( LED / DWDM / PIN / VCSELs ) in diameter up to 6 inch. Indium phosphide ( InP ) crystal is formed by two elements , Indium and Phosphide , growth by Liquid Encapsulated Czochralski ( LEC ) method or VGF method . InP wafer...
...Indium Phosphide Wafer , 4”, Test Grade -InP Wafer Manufacturing PAM-XIAMEN provides single crystal InP(Indium phosphide) wafer for micro-electronic ( HBT/ HEMT ) and opto-electronic industry ( LED / DWDM / PIN / VCSELs ) in diameter up to 6 inch. Indium phosphide ( InP ) crystal is formed by two elements , Indium and Phosphide , growth by Liquid Encapsulated Czochralski ( LEC ) method or VGF method . InP wafer... more
Brand Name:PAM-XIAMEN
Place of Origin:China
Minimum Order Quantity:1-10,000pcs
P Type , Indium Phosphide Wafer , 4”, Test Grade -InP Wafer Manufacturing
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.../3 inch/4 inch 350-650 um InP Crystal Wafer Dummy Prime Semiconductor Substrate Shanghai Xinkehui New Materials Co. Ltd. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in
.../3 inch/4 inch 350-650 um InP Crystal Wafer Dummy Prime Semiconductor Substrate Shanghai Xinkehui New Materials Co. Ltd. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in more
Brand Name:zmkj
Model Number:InP
Place of Origin:CHINA
Single Crystal InP Indium Phosphide Wafers 350 - 650um Thickness
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...wafer ( Indium phosphide ) We provides high quality single crystal InP wafer ( Indium phosphide ) to micro-electronic ( HBT/ HEMT ) and opto-electronic industry ( LED / DWDM / PIN / VCSELs ) in diameter up to 3 inch . Indium phosphide ( InP ) crystal is formed by two elements , Indium and Phosphide , growth by Liquid Encapsulated Czochralski ( LEC ) method or VGF method . InP wafer...
...wafer ( Indium phosphide ) We provides high quality single crystal InP wafer ( Indium phosphide ) to micro-electronic ( HBT/ HEMT ) and opto-electronic industry ( LED / DWDM / PIN / VCSELs ) in diameter up to 3 inch . Indium phosphide ( InP ) crystal is formed by two elements , Indium and Phosphide , growth by Liquid Encapsulated Czochralski ( LEC ) method or VGF method . InP wafer... more
Brand Name:ZG
Model Number:MS
Place of Origin:CHINA
Mechanical Grade Technical Ceramic Parts InP Wafer Indium Phosphide
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Saw blade with diamond plated If you’re searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are ...
Saw blade with diamond plated If you’re searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are ... more
Brand Name:HT
Model Number:HT-WSB
Place of Origin:China
Semiconductor Wafer Saw Blade Thickness 0.015 mm-0.3 mm Gallium Phosphide