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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT...
...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT... more
Brand Name:Horexs
Model Number:HRX
Place of Origin:CHINA
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...
2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ... more
Brand Name:China chao sheng
Model Number:2 layers of COF
Place of Origin:Shenzhen, Guangdong, China
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...
...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates... more
Brand Name:JIMA
Model Number:EDCU-HC
Place of Origin:china
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...
... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ... more
Brand Name:NEWFILM
Model Number:NF-019
Place of Origin:China, Guangzhou
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ... more
Brand Name:TECircuit
Model Number:TEC0211
Place of Origin:China
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Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ...
Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ... more
Brand Name:Bicheng Enterprise Limited
Model Number:BIC-0279-V2.79
Place of Origin:China
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... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency...
... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency... more
Brand Name:TYANSHINE
Model Number:TX-5266W250FC120-NUFENG-A01
Place of Origin:CN
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...CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact luminous surface, ensuring excellent color consistency. Dimensions: Specification: Type CSP...
...CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact luminous surface, ensuring excellent color consistency. Dimensions: Specification: Type CSP... more
Model Number:DM-CSP-SCS-1005A3-1.0W
Payment Terms:T/T, Paypal, Western Union
Delivery Time:7-10 workdays
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... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,
... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application, more
Brand Name:ONESEINE
Model Number:ONE-102
Place of Origin:Shenzhen,China
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KOMAI Hydraulic Filter 21N-60-12210 SH 60007 SPH 9235 0759116 UA HC-5603 BT 9377 P550615 HF28894 CSP10L30 CSP-10L-30 2446U254S3 21N-60-12210 SCP-10L-30 075911603 075911603 1218075911603 1. PRODUCTS DESCRIPTION 1.We use imported depth type filter material,...
KOMAI Hydraulic Filter 21N-60-12210 SH 60007 SPH 9235 0759116 UA HC-5603 BT 9377 P550615 HF28894 CSP10L30 CSP-10L-30 2446U254S3 21N-60-12210 SCP-10L-30 075911603 075911603 1218075911603 1. PRODUCTS DESCRIPTION 1.We use imported depth type filter material,... more
Brand Name:KOMAI
Model Number:HX-28894
Place of Origin:China
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.... Regular size: 5m/coil. 3. Working Voltage: DC12V/24V, Working environment: －20℃～45℃. 4. The LED lamp bead is packaged in Lohua's patented product of high-brightness, high-effificiency CSP lamp bead package. 5.
.... Regular size: 5m/coil. 3. Working Voltage: DC12V/24V, Working environment: －20℃～45℃. 4. The LED lamp bead is packaged in Lohua's patented product of high-brightness, high-effificiency CSP lamp bead package. 5. more
Brand Name:Lohua
Model Number:SL082011WF10030
Place of Origin:China
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... of BT+Noise Reduction+In Ear Detection. It supports dual mode BT 5.3 and multipoint connection. Specification Of BES2600YP Part Number: BES2600YP Package: BGA Type: Ultra Low Power BT Audio SoC Subsystem: Sensor Hub Subsystem Functions: Voice Wake-up And
... of BT+Noise Reduction+In Ear Detection. It supports dual mode BT 5.3 and multipoint connection. Specification Of BES2600YP Part Number: BES2600YP Package: BGA Type: Ultra Low Power BT Audio SoC Subsystem: Sensor Hub Subsystem Functions: Voice Wake-up And more
Brand Name:Original Factory
Model Number:BES2600YP
Place of Origin:CN
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...CSP Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP...
...CSP Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP... more
Brand Name:Hiner-pack
Model Number:3 Inch Series
Place of Origin:Made In China
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2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {...
2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {... more
Substrate Type:Rigid
Layers:2
Size:10mm X 10mm
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... spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 working process: Pre-wash+Wash+ Chemical isolation...
... spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 working process: Pre-wash+Wash+ Chemical isolation... more
Brand Name:SHENHUA
Model Number:SC810
Place of Origin:Guangdong, China
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Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...
Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT... more
Brand Name:wuxi special ceramic
Place of Origin:China
Minimum Order Quantity:10p
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...Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP...
...Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP... more
Brand Name:Loranger
Model Number:Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
Socket Size:15mm x 15mm
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...±0.3A Color 6000K pure white Working temperature -40-160℃ Lifespan >20000 hrs LED source 3570 CSP Packaging & Shipping - In order to protect the goods during transportation, carton and weaving bag are provided according to your requirement. -
...±0.3A Color 6000K pure white Working temperature -40-160℃ Lifespan >20000 hrs LED source 3570 CSP Packaging & Shipping - In order to protect the goods during transportation, carton and weaving bag are provided according to your requirement. - more
Brand Name:Phenson
Model Number:PS-E9
Place of Origin:Guangzhou
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72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A ...
72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A ... more
Brand Name:LEARNEW
Model Number:4055 SERIES
Place of Origin:China
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Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...
Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving... more
Brand Name:ZMSH
Place of Origin:China
Minimum Order Quantity:1
