-
Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ... more
Brand Name:Horexs
Place of Origin:china
Certification:UL
-
2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...
-
BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those things that should top your must-have list...
BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those things that should top your must-have list... more
Brand Name:Hiner-pack
Model Number:HN1837
Place of Origin:Shenzhen China
BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
-
...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...
...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates... more
Brand Name:JIMA
Model Number:EDCU-HC
Place of Origin:china
3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
-
...ICs) F771654BGTP Texas Instrument Integrated Circuits BGA IC components Specification : F771654BGTP Category Integrated Circuits (ICs) Product Name Electronic components Model number F771654BGTP Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package Lead time In stock can be shipped ASAP Features - Package / Case BGA...
...ICs) F771654BGTP Texas Instrument Integrated Circuits BGA IC components Specification : F771654BGTP Category Integrated Circuits (ICs) Product Name Electronic components Model number F771654BGTP Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package Lead time In stock can be shipped ASAP Features - Package / Case BGA... more
Brand Name:Texas Instrument
Model Number:F771654BGTP
Place of Origin:Malaysia
F771654BGTP Texas Instrument BGA IC Integrated Circuits Components
-
...Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips Product Description Of S25FL512SAGBHBA10 S25FL512SAGBHBA10 is FLASH - NOR Memory IC, 512Mbit SPI - Quad I/O, the package is 24-BGA (8x6). Specification Of S25FL512SAGBHBA10 Part Number...
...Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips Product Description Of S25FL512SAGBHBA10 S25FL512SAGBHBA10 is FLASH - NOR Memory IC, 512Mbit SPI - Quad I/O, the package is 24-BGA (8x6). Specification Of S25FL512SAGBHBA10 Part Number... more
Brand Name:Original Factory
Model Number:S25FL512SAGBHBA10
Place of Origin:CN
Integrated Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips
-
...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package...
...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package... more
Model Number:XC6SLX9-2FTG256C
Minimum Order Quantity:1 pcs
Price:Bargain
XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
-
GM8312SF-BA Integrated Circuit BGA IC Chip List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND SW-438TR-3000 M/ACOM ...
GM8312SF-BA Integrated Circuit BGA IC Chip List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND SW-438TR-3000 M/ACOM ... more
Brand Name:GRAIN
Model Number:GM8312SF-BA
Place of Origin:CN
GM8312SF-BA Integrated Circuit BGA IC Chip
-
...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package...
...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package... more
Model Number:XC6SLX9-2FTG256C
Minimum Order Quantity:1 pcs
Price:Bargain
XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
-
IC PCB storage dry cabinet / digital dry cabinet high performance Applications: DC82403LE is equipped with a precise LED control, which has ±3%RH precision tolerance. It is especially designed with fully automatic humidity control at <10%RH to prevent any kinds of moisture damages. This cabinet is the perfect storage for SMT/BGA...
-
vacuum Suction Pen Tools Alternative SMD BGA IC Pick Up Tools wholesale whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 IC Pick Up Tools Specifications: -100% new with high quality. -Low-cost alternative to tweezers for the pickup and placement...
vacuum Suction Pen Tools Alternative SMD BGA IC Pick Up Tools wholesale whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 IC Pick Up Tools Specifications: -100% new with high quality. -Low-cost alternative to tweezers for the pickup and placement... more
Brand Name:Handi-Vac IC Pick Up Tools
Model Number:vacuum pen for IC
Place of Origin:Guangdong, China
vacuum Suction Pen Tools Alternative SMD BGA IC Pick Up Tools wholesale
-
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing ...
-
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ... more
Brand Name:TECircuit
Model Number:TEC0211
Place of Origin:China
IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
-
Robot welding station wds750 repair laptop mobile phone replace chipset hot air smd bga rework welding Product Description Technical parameters of WDS-750 cpu chips removal Power Up heater power:1200W,Down heater power:1200W,IR heater power:4200W(2400W ...
Robot welding station wds750 repair laptop mobile phone replace chipset hot air smd bga rework welding Product Description Technical parameters of WDS-750 cpu chips removal Power Up heater power:1200W,Down heater power:1200W,IR heater power:4200W(2400W ... more
Brand Name:Wisdomshow
Place of Origin:Guangdong, China
Certification:CE
Hot Air 80mm BGA IC Reballing Machine Laptop 2400W IR Heater
-
... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...
-
Auto SMT Dry Cabinet for BGA IC Dry Box Humodity Moisture-Proof Box CWDC-1428B Function: Humidity in the air may have negative effect on the operation of any precision instruments and equipment. Dry cabinet can be used to store these instruments and ...
Auto SMT Dry Cabinet for BGA IC Dry Box Humodity Moisture-Proof Box CWDC-1428B Function: Humidity in the air may have negative effect on the operation of any precision instruments and equipment. Dry cabinet can be used to store these instruments and ... more
Brand Name:SMTfly
Model Number:CWDC-1428B
Place of Origin:Dongguan
Auto SMT Dry Cabinet for BGA IC Dry Box Humodity Moisture-Proof Box
-
ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ...
-
...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The composite material treatment further enhances its
-
#detail_decorate_root .magic-0{width:750px}#detail_decorate_root .magic-1{overflow:hidden;width:750px;height:869.6202531645571px;margin-top:0;margin-bottom:0;margin-left:0;margin-right:0}#detail_decorate_root .magic-2{margin-top:0;margin-left:0;width:750....