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... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound ,
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound , more
Brand Name:Horexs
Place of Origin:CHINA
Certification:UL
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...
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...Apparatus for Packaging Company AC220V Packaging drop test is used to determine the effect of impact on the package during use, transportation, loading and unloading. The strictly designed LABTONE “1G+” ensures its accuracy. Apart from accurate plane fall test, it can also perform edge drop and corner drop test to make a complete evaluation on the performance of packaging...
...Apparatus for Packaging Company AC220V Packaging drop test is used to determine the effect of impact on the package during use, transportation, loading and unloading. The strictly designed LABTONE “1G+” ensures its accuracy. Apart from accurate plane fall test, it can also perform edge drop and corner drop test to make a complete evaluation on the performance of packaging... more
Brand Name:LABTONE
Model Number:DT200
Place of Origin:CHINA
ISTA Drop Tester Laboratory Test Apparatus for Packaging Company AC220V
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...
...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates... more
Brand Name:JIMA
Model Number:EDCU-HC
Place of Origin:china
3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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15mins service time red EEBD Emergency Escape Breathing Apparatus for safety Product display Product description : The EEBD are only used for escape from a compartment that has a hazardous atmosphere to provide personnel breathing protection. Not to be ...
15mins service time red EEBD Emergency Escape Breathing Apparatus for safety Product display Product description : The EEBD are only used for escape from a compartment that has a hazardous atmosphere to provide personnel breathing protection. Not to be ... more
Brand Name:FANGZHAN
Model Number:TH/15-1
Place of Origin:China
High Durability Emergency Escape Breathing Apparatus Box Packaging
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Slope Inclined Impact Testing Machine for Package Carton Bevel Impact Testing Machine Model: P5200 Application: One of the most utilized pieces of shock test equipment in package testing is the Incline Impact or Conbur tester. The specialized machine ...
Slope Inclined Impact Testing Machine for Package Carton Bevel Impact Testing Machine Model: P5200 Application: One of the most utilized pieces of shock test equipment in package testing is the Incline Impact or Conbur tester. The specialized machine ... more
Brand Name:Infinity Machine
Model Number:P5200
Place of Origin:Made in China
Slope Inclined Impact Test Apparatus For Package Carton
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ... more
Brand Name:TECircuit
Model Number:TEC0211
Place of Origin:China
IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ...
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... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency...
... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency... more
Brand Name:TYANSHINE
Model Number:TX-5266W250FC120-NUFENG-A01
Place of Origin:CN
High Efficiency 300W LED Lighting Engine 8000K Multi Chip CSP LED Module
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...CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact luminous surface, ensuring excellent color consistency. Dimensions: Specification: Type CSP...
...CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact luminous surface, ensuring excellent color consistency. Dimensions: Specification: Type CSP... more
Model Number:DM-CSP-SCS-1005A3-1.0W
Payment Terms:T/T, Paypal, Western Union
Delivery Time:7-10 workdays
1.0*0.5mm Wafer Packaging 1005 CSP Chip LED Chip 1800-6500K For Smartwatch Automotive Interior Lighting
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... during the range of visible and near IR spectrum.It is widely used for led substrates for GaN Epitaxial growth ;and also as optical window in infrared and far infrared military equipments, apparatus and instruments of satellite and space technology, and
... during the range of visible and near IR spectrum.It is widely used for led substrates for GaN Epitaxial growth ;and also as optical window in infrared and far infrared military equipments, apparatus and instruments of satellite and space technology, and more
Brand Name:ZMKJ
Model Number:2INCH A-axis
Place of Origin:CHINA
2 Inch Sapphire Substrate Wafer A R-Axis For GaN Epitaxial Growth Customized
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Quartz Apparatus Optical Lab Instruments We have more than 25 years industry experience in quartz glass processing. We specialize in quartz glass capillary tubes and rods, quartz glass substrates, CNC machined quartz, and quartz instruments etc. According...
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.... Regular size: 5m/coil. 3. Working Voltage: DC12V/24V, Working environment: -20℃~45℃. 4. The LED lamp bead is packaged in Lohua's patented product of high-brightness, high-effificiency CSP lamp bead package. 5.
.... Regular size: 5m/coil. 3. Working Voltage: DC12V/24V, Working environment: -20℃~45℃. 4. The LED lamp bead is packaged in Lohua's patented product of high-brightness, high-effificiency CSP lamp bead package. 5. more
Brand Name:Lohua
Model Number:SL082011WF10030
Place of Origin:China
CSP Lamp Bead 3V 120mA 29W 80Lm CSP Led Strip Module
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...CSP Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP...
...CSP Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP... more
Brand Name:Hiner-pack
Model Number:3 Inch Series
Place of Origin:Made In China
ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC
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... spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 working process: Pre-wash+Wash+ Chemical isolation...
... spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 working process: Pre-wash+Wash+ Chemical isolation... more
Brand Name:SHENHUA
Model Number:SC810
Place of Origin:Guangdong, China
SC810 Semiconductor packaging parts deflux machine with CE approval
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Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...
Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT... more
Brand Name:wuxi special ceramic
Place of Origin:China
Minimum Order Quantity:10p
Optical Communication Packaging Aluminum Nitride Ceramic Substrate
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...Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP...
...Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP... more
Brand Name:Loranger
Model Number:Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
Socket Size:15mm x 15mm
Loranger 006004006J6617 Test Socket 6 I/O and 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 cycles
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...±0.3A Color 6000K pure white Working temperature -40-160℃ Lifespan >20000 hrs LED source 3570 CSP Packaging & Shipping - In order to protect the goods during transportation, carton and weaving bag are provided according to your requirement. -
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72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A ...