CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
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mobile phone COF driver Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement Product Description Number of floors: 1 floor Plate thickness: 0.15mm, Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement, minimum ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2
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...interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving high-density interconnections between chips, as well as between chips and substrates. While TSV (Through Silicon Via) technology is used for interposers in silicon-based substrates......
SHANGHAI FAMOUS TRADE CO.,LTD
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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Zirconia ZrO2 Ceramics Substrate Sheets Plates
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... close to that of steel. Mainly: Y-TZP grinding ball, dispersion and grinding media, nozzle, ball valve ball seat, zirconia mold, micro fan shaft, fiber pin, fiber sleeve, wire drawing die and...
Wuxi Special Ceramic Electrical Co.,Ltd
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Water Based Barrier Coat Production Line Coating Pulp Molding
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Product Description: Version 2.0 of 24-station spin coating production ... The 24-Station Spin Coating Production Line Version 2.0 offered by Dongguan Osmanuv Machinery Equipment Co., Ltd. is a cutting-edge solution for precise coating applications in ......
Dongguan Osmanuv Machinery Equipment Co., Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates and HDI(High-density-interconnect......
JIMA Copper
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100mm/S Speed Semiconductor Molding Machine Chip Molding Equipment Energy Saving
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...Molding Equipment Features: ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● Applicable leadframe/substrate......
Guangdong Taijin Semiconductor Technology Co., Ltd
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718H S136 P20 P20H Plastic Injection Moulds With 2K Bezel substrate
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...-made plastic injection molding service molded plastic parts Mold Material S136/2344/718/738/NAK80/P20, etc. Plastic Material ABS, PP, PC, PVC, POM, TPU, PC, PEEK,HDPE,NYLON, PA6+30%GF, PA66, Silicone, Rubber, etc. Mold Base LKM,...
Shenzhen Benky Industrial Co., Ltd.
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Single Side Carbonized Paper Substrate for Precise PCB Manufacturing
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PCB manufacturing Single side carbonized paper substrate PCB manufacturing Single side carbonized paper substrate | GSSMT, Multilayer PCB, PCB fabrication process, HDI PCB (High-Density Interconnect), PCB assembly services, Flexible circuit boards, Rigid-......
Global Soul Limited
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Metal Edge PCB Fr4 IT180A Material ELIC Any Interconnection Circuit Board
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...Material ELIC Any interconnection Circuit Board PCB information: Brand:Oneseine 10 layer PCB with bonding layers Substrate material: IT180A 1.0mm Surface finish:ENIG+OSP Copper:0.5OZ Min line width&space:2.5mil Special: ELIC Any interconnection and metal ......
ONESEINE TECHNOLOGY CO.,LTD
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