BGA IC Package Substrate With Cap Plated MGC BT material
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Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those things that should top your must-have list......
Shenzhen Hiner Technology Co.,LTD
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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F771654BGTP Texas Instrument BGA IC Integrated Circuits Components
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...ICs) F771654BGTP Texas Instrument Integrated Circuits BGA IC components Specification : F771654BGTP Category Integrated Circuits (ICs) Product Name Electronic components Model number F771654BGTP Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package Lead time In stock can be shipped ASAP Features - Package / Case BGA......
Angel Technology Electronics Co
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Integrated Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips
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...Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips Product Description Of S25FL512SAGBHBA10 S25FL512SAGBHBA10 is FLASH - NOR Memory IC, 512Mbit SPI - Quad I/O, the package is 24-BGA (8x6). Specification Of S25FL512SAGBHBA10 Part Number......
ShenZhen Mingjiada Electronics Co.,Ltd.
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XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
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...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
LU'S TECHNOLOGY CO., Ltd.
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GM8312SF-BA Integrated Circuit BGA IC Chip
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GM8312SF-BA Integrated Circuit BGA IC Chip List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND SW-438TR-3000 M/ACOM ......
Shenzhen Koben Electronics Co., Ltd.
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XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
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...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
ChongMing Group (HK) Int'l Co., Ltd
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IC PCB storage dry cabinet / digital dry cabinet for emiconductor IC Packages BGA PGA,IC PCB SMT PBGA
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IC PCB storage dry cabinet / digital dry cabinet high performance Applications: DC82403LE is equipped with a precise LED control, which has ±3%RH precision tolerance. It is especially designed with fully automatic humidity control at <10%RH to prevent any kinds of moisture damages. This cabinet is the perfect storage for SMT/BGA......
SUPER SECURITY LTD
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