High Speed Hot Bar Soldering Machine Bonding PCB And Fpc Board

Specification For Hot Bar Welding Machine YSPC-1A

1 . Establish year:1999
2 . lead time:5days
3 . working area:200*260mm
4 . fixture:1set

Specifications :

Microprocessor based controller provides precise and consistent temperature control .

Feature :

1 . Extremely short cycle time with rotary table design
2 . Product loading and unloading can be done during the heat sealing process
3 . High quality heat seal application up to 0.25mm pitch
4 . Pneumatic bonding head provide up to 3,900N force
5 . Digital programmable pressure control with LCD display
6 . Closed loop PID temperature control with visible LED display
7 . Bonding cycle is triggered by a real time pressure sensor
8 . Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
9. Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
10. Optional CCD alignment module with frame , camera , lens , monitor and illumination for fine pitch application
11. Full microprocessor logic control