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Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board

Categories Multi Layer PCB
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
PCB Material: RO4350B - 0.254 mm (10mil); S1000-2M - 1.1 mm (43mil)
Layer Count: 4-layer
PCB Thickness: 1.6 mm
Solder Mask: Green
Silkscreen: White
Surface Finish: ENIG (Electroless Nickel Immersion Gold)
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Hybrid PCB 10mil RO4350B and S1000-2M 4-Layer 1.6mm Impedance Board

When it comes to high-frequency and high-reliability electronics, the foundation of your design lies in the PCB. Our 4-layer PCB, built with Rogers RO4350B and S1000-2M materials, is meticulously designed to meet the demands of RF, microwave, and high-speed digital applications. Whether you're developing commercial airline broadband antennas, radar systems, or millimeter-wave devices, this PCB delivers unmatched performance, thermal stability, and reliability.


Core Specifications
Layer Count: 4

Materials: RO4350B (top layers) and S1000-2M (core)

Solder Mask: Green (Top), None (Bottom)

Silkscreen: White (Top), None (Bottom)

Surface Finish: ENIG (Electroless Nickel Immersion Gold)

Board Thickness: 1.6mm

Dimensions: 90mm x 95mm (±0.15mm)

Trace/Space: 5mil / 4mil (minimum)

Hole Size: 0.35mm (minimum)

Via Plating: 20μm thickness

Via Filling/Capping: 0.35mm vias filled and capped

Impedance Control: 50Ω on top layer (5mil/9mil trace/gap)

Edge Plating: Applied to designated areas


PCB Stack-Up
Our 4-layer PCB is constructed with precision to ensure optimal electrical and thermal performance:


Layer 1 (Top): 35μm copper

RO4350B Laminate: 0.254mm (10mil)

Layer 2 (Inner): 35μm copper

Prepreg (1080 RC63%): 0.0644mm (2.5mil)

Layer 3 (Inner): 35μm copper

S1000-2M Core: 1.1mm (43mil)

Layer 4 (Bottom): 35μm copper


Why RO4350B?
RO4350B is a game-changer for RF and microwave applications, offering:


Consistent Dk: 3.48 ±0.05 @ 10GHz/23°C

Ultra-Low Loss: Dissipation factor of 0.0037 @ 10GHz/23°C

Exceptional Thermal Stability: Tg >280°C (536°F)

Low CTE: Matches copper for excellent dimensional stability (X/Y: 10/12 ppm/°C, Z: 32 ppm/°C)

Minimal Water Absorption: 0.06% for reliable performance in humid conditions

Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation

UL 94 V-0 Rating: Ideal for high-power RF designs


RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280℃ TMAAIPC-TM-650 2.4.24.3
Td390℃ TGAASTM D 3850
Thermal Conductivity0.69W/M/oK80℃ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.86gm/cm323℃ASTM D 792
Copper Peel Stength0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0UL 94
Lead-free Process CompatibleYes

Why S1000-2M?
S1000-2M complements RO4350B with its robust mechanical and thermal properties:


Low Z-Axis CTE: Enhances through-hole reliability


High Heat Resistance: Tg of 180°C (DSC)


Anti-CAF Performance: Ensures long-term reliability in high-density designs


Low Water Absorption: Maintains stability in challenging environments


UV Blocking/AOI Compatibility: Supports automated optical inspection


Quality Assurance
We are committed to delivering PCBs that meet the highest standards of quality and reliability. Our manufacturing process adheres to IPC-Class-2 compliance, ensuring robust performance for a wide range of industrial applications.


All constructions are supplied in Gerber RS-274-X format, guaranteeing compatibility with your production systems. Before shipment, every PCB undergoes 100% electrical testing to verify functionality and eliminate defects.


With global availability, we are ready to ship our high-quality PCBs to your location, no matter where you are in the world. Trust us to provide the precision and reliability your projects demand.



Ideal Applications
This PCB is perfect for:


Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter-Wave Devices

Radar and Guidance Systems

Point-to-Point Digital Radio Antennas


Why Choose Us?
Cutting-Edge Materials: RO4350B and S1000-2M deliver superior electrical and thermal performance.


Precision Engineering: Features like impedance control, via filling, and edge plating ensure reliability.


Global Support: We ship high-quality PCBs worldwide, ensuring timely delivery.


Proven Reliability: Compliant with IPC-Class-2 standards, our PCBs are built to withstand the toughest conditions.


Contact Us Today!
If you're looking for a high-performance PCB solution for RF, microwave, or high-speed digital applications, this 4-layer PCB is the answer. Reach out to us today to discuss your requirements or request a quote.


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