| Categories | SMT AOI Machine |
|---|---|
| Brand Name: | Sinictek |
| Model Number: | A510 /A630 A510DL /A630DL / A1200 |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1 |
| Payment Terms: | T/T |
| Supply Ability: | The production capacity is 100 units a month |
| Delivery Time: | 7-15 |
| Packaging Details: | Vacuum packing plus wooden box packing |
| Price: | 50000 |
| Name: | SMT 3D AOl machine |
| Brand name: | Sinictek |
| Product name: | Automated Optical Inspection equipment |
| Maximum board size: | 450 x 450mm(A510) / 600 x 550mm(A630) |
| Model number: | A510 /A630 A510DL /A630DL / A1200 |
| Usage: | Electronic manufacturing |
| Core components: | PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump |
| Application: | SMT PCB Assembly Production Line |
| Warranty: | 1 Year |
Programmable structure grating (PSLM) technology
The programmable structure grating (PSLM) is developed and manufactured independently to form a full-spectrum structure grating. Compared with the traditional moiré gratings, the structure grating can be modulated and controlled by software The detection capability and application range of the equipment are greatly improved.
AI intelligent seamless puzzle technology
3D SMT AOI adopts innovative AI intelligent seamless jigsaw puzzle technology, which reaches the level of indiscernibility to the naked eye, and for the problems of uneven, uneven, uneven color and image distortion encountered at the joint between Fov and Fov of traditional Aoi, it improves the positioning accuracy of the detection box and reduces the debugging time of the program. After intelligent seamless mosaic technology processing of the image, can not see uneven, uneven, uneven color, image distortion
| Technology Platform | Single lane Type-c Platform | Dual-track Type-c Platform | Large platform | ||||
| Series A Series A Series A Series | |||||||
| Model | A510 /A630 | A510DL /A630DL | A1200 | ||||
| Measurement Principle Sine white projection PMP inspection | |||||||
| Measurements | Missing parts, offset, rotation, three-dimensional polarity, upside down, OCV, side standing, tombstone, poor soldering, etc. | ||||||
| Detection of Non-Performing Types | Solder tip, solder volume percentage, excessive solder, insufficientsolder, bridge, hole plugging, solder filet, pad contamination, etc. | ||||||
| Lens Resolution | 6.5M 13.5um/16.5um option；12M 12um/15um option | ||||||
| Accuracy XY (Resolution):10um | |||||||
| Repeatability | height:≤1um (4 Sigma);volume/acreage:<1% (4 Sigma); | ||||||
| Gage R&R <<10% <<10% <10% | |||||||
| Inspection Speed | 0.45 SEC/FOV | 0.45 SEC/FOV | 0.45 SEC/FOV | ||||
| Quanlity of Inspection Head 4piece | |||||||
| Mark-point Detection Time | 0.5sec/piece | ||||||
| Maximun Meauring Head 10mm | |||||||
| Maximum height of element on PCB | 50mm | 50mm | 50mm | ||||
| Maximun Measuring Height of PCB Warp | ±5mm | ||||||
| Minimum element | 1005 | 1005 | 1005 | ||||
| MaximunLoading PCB Size(X*Y) | 450x450mm (A510) | 450x310+450x310mm (A510DL) 630x310+630x310mm (A630DL) | 1200x650mm | ||||
| 600x550mm (A630) | |||||||
| Conveyor Setup | front orbit (back orbit as option) | ||||||
| PCB Transfer Direction Left to right or Right to left | |||||||
| Conveyor Width Adjustment | Manual and Automatic | ||||||
| Engineering Statistics SPC | :Production Trend；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；AOI Daily/Weekly/Monthly Reports | ||||||
| Gerber & CAD Data Import | (support Gerber format(274x,274d),Artificial called the pattern, X/Yimport CAD) | ||||||
| Operating System Support Windows 10 Professional (64 bit) | |||||||
| Equipment Diemension and Weight | W1000xD1174xH1550 985Kg | W1000xD1350xH1550 1080Kg | W1730xD1320xH1530mm 1250Kg | ||||
| Optional | 1D /2 D Barcode Scanner; Badmark Function; three-point function; offline programming; Repair Station | ||||||
3D AOI has a complete SPC analysis software and closed-loop control, to ensure that 3D AOI test data can be fully statistical and analytical, and can be easily traceable; 3DAOI three-point integration function, using Sinic-Tek's 3DSPI and 3DAOI, specific measurements of a single PAD can be queried.
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
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