USB wireless card patch processing is a key process to accurately
place tiny electronic components on the circuit board to achieve
stable signal transmission, and the process is fine and rigorous.
The first is solder paste printing. On the circuit board solder pad
that has been cleaned and dried in the early stage, the automatic
solder paste printing machine uses steel mesh to accurately control
the amount and position of solder paste to ensure uniform printing
and consistent thickness, laying the foundation for subsequent
component welding.
Then is the component mounting, with the help of high-speed and
high-precision Surface Mount Technology mounter, in accordance with
the pre-set program, the resistance, capacitor, chip and other
types of micro electronic components, from the tray accurately
grabbed and affixed to the printed solder paste circuit board
corresponding position, each step of the operation is carried out
with micron level accuracy, to ensure the accuracy of the mounting.
Then it enters the reflow welding process, and the circuit board
with the installed components is sent to the reflow welding
furnace. Under the control of the precise temperature curve, the
solder paste is melted by heat and cooled and solidified, so that
the components and the circuit board solder pad form a solid
electrical connection. This process requires extremely high
temperature and time control, which directly affects the welding
quality.
After the welding is completed, strict AOI automatic optical
inspection is carried out, the use of optical imaging technology to
scan the circuit board in an all-round way, compared with the
preset standards, quickly and accurately identify the component
offset, missing parts, short circuit and other defects, and pick
out unqualified products for rework.
After testing qualified USB wireless card circuit board, it will be
cleaned, remove the residual flux, dust and other impurities in the
production process, and then carry out functional testing to verify
whether its wireless signal reception and transmission performance
is up to standard. Only the products that pass all the testing can
enter the final packaging process, and properly package them with
anti-static packaging materials. To ensure that the product is not
damaged in subsequent transportation and storage, the entire USB
wireless card patch processing process is completed.
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