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PCB Automatic Selective Soldering System 30kw Select Solder Machine Single

Categories Selective Wave Soldering Machine
Brand Name: Suneast
Model Number: SUNFLOW 3/450
Certification: CE、ISO
Place of Origin: Shenzhen, Guangdong Province, China
MOQ: ≥1 pc
Payment Terms: T/T
Delivery Time: 25~50 days
Packaging Details: Plywood crate
Price: Negotiable
Name: Selective Soldering Machine
Model: SUNFLOW 3/450
Dimension: 2710(L)*1930(W)*1630(H)mm
Weight: 1500kg
Max PCB size: 510(L)*450(W)mm
Min PCB size: 120(L)*50(W)mm
Air Input Pressure: 0.6Mpa
Required Purity of Nitrogen: >99.999%
Supply Voltage: 380VAC
Max Power Consumption: <30kw
Max soldering temperature: 330℃
Customizable: Yes
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PCB Automatic Selective Soldering System 30kw Select Solder Machine Single

Selective Solder Machine Single With Electromagnetic Pump SUNFLOW 3/450


Selective wave soldering is a special form of wave soldering applied to PCB plug-in through-hole soldering. Selective wave soldering generally consists of three modules: flux spraying, preheating, and soldering. The flux nozzle moves to the command position according to the pre programmed program, and selectively spray the position to be welded. After the PCB is preheated by the upper and lower preheating modules, the welding module performs welding according to the programming path.

Selective wave soldering is mainly used in high-end electronic products such as military aerospace, automotive electronics, railway products, switch power supplies, etc. It can meet the through-hole soldering requirements of multi-layer PCBs with high soldering requirements and complex processes.


Features:

  • Independent R&D electromagnetic pump
  • Chain and roller hybrid drive system
  • Automatic rail width adjustment system
  • High precision spray nozzle
  • Bottom side infrared preheating
  • Top side hot air convection heating
  • Support online/offline programming, easy programming
  • Welding parameters can be set independently for each solder joint
  • Display welding status throughout the whole process
  • Extensible to dual electromagnetic pumps selective soldering

Overall diagram:

Soldering process

  • Transport the PCB to flux module
  • Spray head move to programed area and flux is applied only to the soldering joint to be made
  • Top-side and bottom-side preheat
  • Programed electromagnetic pump soldering perfectly formed solder joint
  • PCB is transported out


Basic machine module:

  • Flux Module
  • Preheat Module
  • Soldering Module
  • Conveyor System

Working Process:After PCB is moved to flux area,the spray head is targeted to the programed position and the flux is applied only to the solder joint to be made. After preheating,the electromagnetic pump moves to the target area and solder joint is made.


Selective soldering system introduction:

Fast and comfortable programing:

  • A variety of programming options are available
  • Different parameter for every soldering point
  • Offline programing
  • Process data record

Smooth conveying system:

Conveyor System combines chain and roller transports. Chain transport system is chosen in flux and preheating module. The soldering module use the roller transport which performs good in location board and repeatability

High precision spray system:

The standard machine uses a precision drop nozzle with diameter of 130μm, which can evenly spray the flux to the required soldering area. The minimum spray area is 3mm, saving at least 90% flux compared to conventional spray

Perfect preheating system:

Combine stop heater and bottom heater and it sill performs perfectly even for the lead-free soldering or multi-layer boards. Top convection heater has been proved by Sun East Reflow machine for many years and it can offer an even temperature distribution over the complete

board. Bottom IR emitter heater provides optional heating area according the custom board. At the same time, another top heater covers the soldering module and it can maintain the board temperature in all the cycle time.

Stable and high quality soldering system:

  • Electromagnetic solder pump
  • Stable wave height
  • Quick-change solder nozzles
  • Special solder nozzle
  • Low maintains required
  • Welding process can be recorded

Common options:

  1. Automatic tinning
  • Support 2mm diameter tin wire.
  • Support 1kg to 4kg tin wire coil installation.
  • Tin addition frequency and time can be set to meet the requirements of liquid level height.
  1. Automatic cleaning
  • Powder cleaning method.
  • Customize the cleaning location.
  • Supports setting of cleaning frequency and cleaning time.
  • Solve the nozzle oxidation problem.
  1. Fiducial identification and positioning function
  • High definition camera configuration.
  • Can set multiple image recognition modes.
  • The recognition function can be turned on or off separately.
  • Can turn on or off the recognition function separately.

Product parameters:

ModelSUNFLOW 3/450SUNFLOW 3/610
General Parameters

Overall dimension(mm)

(Not include indicator light and monitor)

2710(L)*1930(W)*1630(H)3040(L)*2240(W)*1630(H)
Equipment Weight (kg)15502000
Max PCB size(mm)510(L)*450(W)610(L)*610(W)
Min PCB size(mm)120(L)*50(W)120(L)*50(W)
PCB Top Side Clearance (mm)120120
PCB Bottom Side Clearance (mm)6060
PCB process edge (mm)≥3≥3
Conveyor Height From Floor (mm)900±20900±20
PCB Conveying Speed (m/min)0.2-100.2-10
Max/ PCB Weight (kg)≤8≤8
PCB Thickness With Jig (mm)1-61-6
Conveyor Width Adjustment Range(mm)50-45050-610
Conveyor Width Adjustment ModeElectricElectric
PCB Conveying DirectionLeft to rightLeft to right
Air Input Pressure (Mpa)0.60.6
Nitrogen SupplyOffered by customerOffered by customer
Nitrogen Input Pressure(Mpa)0.60.6
Nitrogen Consumption (m³/h)1.51.5
Required Purity of Nitrogen(%)>99.999>99.999
Supply Voltage(VAC)380380
Frequency (HZ)50/6050/60
Max Power Consumption (kw)<30<36
Max Current(A)<56<61
Ambient Temperature (℃)10-3510-35
Machine Noise Level (dB)<65<65
Communication InterfaceSMEMASMEMA
Soldering System
Max. Soldering distance of X axis (mm)510610
Max. Soldering distance of Y axis (mm)450610
Max. Soldering distance of Z axis (mm)6060
Min outer diameter of nozzle(mm)5.55.5
Nozzle inner diameter (mm)2.5-102.5-10
Max soldering wave height (mm)55
Solder pot capacity (kg)

Approx.13kg(Sn63Pb)/solder pot

Approx.12kg(lead-free)/solder pot

Approx.13kg(Sn63Pb)/solder pot

Approx.12kg(lead-free)/solder pot

Max soldering temperature (℃)330330
Soldering heating power (kw)1.151.15
Preheating System
Preheat temperature range (℃)<200<200
Heating power (kw)1721.5
Heating modeHot air+InfraredHot air+Infrared
Top side preheatingHot airHot air
Spraying System
Max. stroke of X axis (mm)510610
Max. stroke of Y axis (mm)450610
Spray height(mm)6060
Location speed(mm/s)<400<400
Spray head automatically cleaningProgram controlProgram control
Flux box capacity (L)22

Notices:

1.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②The wire diameter requirement is 16mm², with a leakage protection switch of 125A and a leakage capacity of 150-200mA.

2.The ground is required to withstand a pressure of 1000kg/m².

3.External ventilation requirements:

①Spray: Duct specification: Ø 150mm exhaust volume 150M³/H;

②Welding: Duct specification: Ø 150mm exhaust volume 150M³/H.

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