Categories | Silicon Carbide Wafer |
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Brand Name: | ZMSH |
Place of Origin: | China |
Delivery Time: | 2-4 weeks |
Payment Terms: | 100%T/T |
Type: | 4H |
Grade: | Production/ Research/ Dummy |
Edge Exclusion: | ≤50um |
Surface Finish: | Single/Double Side Polished |
Resistivity: | High/Low Resistivity |
Orientation: | On-Axis/Off-Axis |
Material: | Silicon Carbide |
Diameter: | 4inch 6inch |
SiC Epitaxial Wafer Silicon Carbide 4H 4inch 6inch High Resistivity Semiconductor Industry
Silicon carbide epitaxy is a compound semiconductor material composed of carbon and silicon elements (excluding doping factors). Silicon carbide (SiC) epitaxial sheet is an important semiconductor material, widely used in high power, high temperature and high frequency electronic devices. Silicon carbide has a wide band gap (about 3.0 eV), making it excellent at high temperatures and high voltages. Excellent thermal conductivity enables effective heat dissipation and is suitable for high power applications. Common epitaxial growth techniques include chemical vapor deposition (CVD) and molecular beam epitaxy (MBE). The thickness of the epitaxial layer usually ranges from a few microns to several hundred microns. Used to manufacture power electronic devices (such as MOSFETs, diodes, etc.), widely used in electric vehicles, renewable energy and power transmission fields. It is also used in high temperature sensors and RF devices. Compared with traditional silicon materials, SiC devices have higher voltage resistance and better efficiency. It can maintain stable performance in high temperature environment. With the growth of electric vehicles and renewable energy markets, the demand for silicon carbide epitaxial sheets continues to rise.
Our company specializes in silicon carbide homogenous epitaxial products grown on silicon carbide substrates, known for their high voltage tolerance, strong current endurance, and high operational stability. These characteristics make it a crucial raw material for manufacturing power devices. Silicon carbide epitaxial wafers serve as the cornerstone for producing power devices and are essential for optimizing device performance.
A. Crystal Structure
This polytype has a smaller lattice constant, high electron mobility, and saturation electron velocity, making it ideal for high-frequency and high-power devices. The bandgap width of 4H-SiC is approximately 3.26 eV, providing stable electrical performance at high temperatures.
B. Electronic Properties
The bandgap width of silicon carbide determines its stability at
high temperatures and under high electric fields. The wide bandgaps
of 4H-SiC and 6H-SiC, at 3.26 eV and 3.02 eV respectively, allow
them to maintain excellent electrical performance at temperatures
reaching several hundred degrees, while traditional silicon (Si)
has a bandgap width of only 1.12 eV.
Saturation Electron Velocity: Silicon carbide has a saturation
electron velocity close to 2 × 10⁷ cm/s, about twice that of
silicon, further enhancing its competitiveness in high-frequency
and high-power applications.
C. Thermal Properties
Silicon carbide exhibits excellent thermal conductivity and
coefficient of thermal expansion, making it perform exceptionally
well in high-power and high-temperature environments.
Coefficient of Thermal Expansion: The coefficient of thermal
expansion of silicon carbide is around 4.0 × 10⁻⁶ /K, similar to
silicon. Its stable high-temperature performance helps reduce
mechanical stress during thermal cycling processes.
D. Mechanical Properties
Silicon carbide is known for its hardness, abrasion resistance,
excellent chemical stability, and corrosion resistance.
Hardness: Silicon carbide has a Mohs hardness of 9.5, close to that
of diamond, providing it with high wear resistance and mechanical
strength.
Chemical Stability and Corrosion Resistance: The stability of
silicon carbide at high temperatures, pressures, and harsh chemical
environments makes it suitable for electronic devices and sensor
applications in harsh conditions.
1. Material Characteristics
Silicon carbide power devices differ in manufacturing processes
from traditional silicon power devices. They cannot be directly
fabricated on single-crystal silicon carbide material. Therefore,
high-quality epitaxial layers need to be grown on conductive-type
single-crystal substrates, where various devices can be
manufactured.
2. Enhancing Material Quality
Silicon carbide substrates may contain defects like grain
boundaries, dislocations, impurities, etc., which can significantly
impact device performance and reliability. Epitaxial growth helps
in forming a new layer of silicon carbide on the substrate with a
complete crystal structure and fewer defects, thereby significantly
enhancing material quality.
3. Precise Control of Doping and Thickness
Epitaxial growth allows for precise control of the doping type and
concentration in the epitaxial layer, as well as the thickness of
the epitaxial layer. This is crucial for manufacturing
high-performance silicon carbide-based devices, as factors like
doping type and concentration, epitaxial layer thickness, etc.,
directly affect the electrical, thermal, and mechanical properties
of the devices.
4. Control of Material Characteristics
By epitaxially growing SiC on substrates, different crystal
orientations of SiC growth can be achieved on various substrate
types (such as 4H-SiC, 6H-SiC, etc.), obtaining SiC crystals with
specific crystal face directions to meet the material
characteristic requirements of different application fields.
5. Cost Efficiency
Silicon carbide growth is slow, with a growth rate of only 2 cm per
month, and a furnace can produce around 400-500 pieces per year.
Through epitaxial growth on substrates, batch production can be
achieved in large-scale production processes, improving production
efficiency and reducing manufacturing costs. This method is more
suitable for industrial production needs compared to directly
cutting SiC blocks.
Silicon carbide epitaxial wafers have a wide range of applications in power electronic devices, spanning areas such as electric vehicles, renewable energy, and industrial power systems.
1. Q:What is SiC epitaxy?
A:Epitaxial growth is used to produce active layers of silicon
carbide (SiC)-based device structures with designed doping density
and thickness.
2. Q:How does epitaxy work?
A: epitaxy, the process of growing a crystal of a particular
orientation on top of another crystal, where the orientation is
determined by the underlying crystal.
3. Q:What does epitaxy mean?
A: Epitaxy refers to the deposition of an overlayer on a
crystalline substrate, where the overlayer is in registry with the
substrate.
(click the picture for more)
1. We can customize the size of the SiC substrate to meet your specific requirements.
2. The price is determined by the case, and the packaging details can be customized to your preference.
3. Delivery time is within 2-4 weeks. We accept payment through T/T.
4. Our factory has advanced production equipment and technical team, which can customize various specifications, thicknesses and shapes of SiC wafer according to customers' specific requirements.
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