Categories | Rogers PCB |
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Place of Origin: | Shenzhen,China |
Brand Name: | ONESEINE |
Certification: | ISO9001,ISO14001 |
Model Number: | ONE-102 |
MOQ: | 1pcs |
Price: | USD0.1-1000 |
Packaging Details: | Vacuun bag |
Delivery Time: | 5-8 working days |
Payment Terms: | T/T, Western Union |
Supply Ability: | 1000000000pcs/mon |
Layer: | 6 |
Material: | Rogers RO4350B + FR4 Hybrid |
Type: | High Frequency PCB |
Min Line Space: | 4mil |
Hole: | resin plug hole |
Min. Line Width/Spacing: | 4mil/4mil |
Panel: | 1*1 |
Solder Mask Type: | Liquid Photo Imageable (LPI) |
Min. Hole Size: | 0.2mm |
Board Thickness: | Mechanical drill: 8mil(0.2mm) |
Panel Size: | 3*2 |
Layers: | 4350+4450F |
6L Rogers RO4350B Fr4 Hybrid High Frequency PCB Board
PCB parameter:
Material:Rogers RO4350B
Layers:6
Board thickness:1.6mm
Copper:1OZ
Dielectric thickness:0.508mm
Dielectric constant:3.48
Thermal conductivity:0.69w/m.k
Flame retardant rating:V-0
Volume resistivity:1.2*1010
Surface resistivity:5.7*109
Density:1.9gm/cm3
Surface finish:Immersion gold
Application: Radio frequency communication
Rogers PCB description:
Rogers PCB refers to printed circuit boards (PCBs) that are made using Rogers Corporation's high-performance materials. Rogers Corporation is a global leader in engineered materials for various industries, including electronics.
Rogers PCBs are widely used in applications that require high-frequency performance, excellent electrical properties, and thermal stability. The Rogers materials used in these PCBs have unique characteristics, such as low dielectric loss, high dielectric constant, and excellent signal integrity.
The most popular Rogers material for PCBs is Rogers RO4000 series, which includes materials like RO4350B, RO4003C, and RO3003. These materials are commonly used in high-frequency applications, such as wireless communication systems, radar systems, aerospace, and satellite systems.
Rogers PCBs offer several advantages, including low insertion loss, low signal distortion, and high reliability. They provide better performance at high frequencies compared to standard FR-4 PCBs. However, Rogers PCBs are typically more expensive than traditional PCBs due to the specialized materials used.
When designing and manufacturing Rogers PCBs, it's important to work with experienced PCB manufacturers who are familiar with the specific requirements and handling of Rogers materials. They can help ensure proper material selection, stack-up design, and manufacturing processes to achieve the desired electrical performance.
It's worth noting that the information provided here is based on the knowledge available up until September 2021. For the most up-to-date information on Rogers PCBs and materials, I recommend consulting Rogers Corporation's official website or contacting a reputable PCB manufacturer.
ROGERS RF PCB DESIGN AND MANUFACTURING PROCESS
How to design a good RF PCB Layout? Simple tips to design RF PCB
layout. In this section, we will discuss the simple tips when you
want to design a PCB layout for RF applications with rogers pcb
material. Tips provided here don’t include talking about Smith
charts, Q factor, S parameters, etc which need a lot of academic
knowledge. Instead, we will discuss “the simple way” to design the
RF PCB layout. Below are some simple tips to start with:
1. No single-shot perfect RF layout. If your design (e.g. antenna)
does not perform as expected in your simulations, it is perfectly
normal. It could happen because the antenna impedance is influenced
by components located around it, and the impedance may shift in a
way that cannot be predicted in software simulations. The best that
you can do is adding a matching network that lets you tune the
antenna in your final product. Moreover, not only antennas that
require impedance matching, but also between different RF
components or subsections on board need it for proper interfacing.
And of course, iteration is a key!
2. Use 4-Layer Design. Multi-layer PCB is best. It’s not obligatory
to use 4 layers in RF design. You can do the 2-layer design but you
need to read some advanced RF concepts. If it is quite hard for you
to make an advanced RF study of your circuit or because it takes so
much time, then you can use 4-layer design as a solution. Don’t
forget to put continuous grounds under traces. And consider
material selection carefully. Standard FR-4 may not meet your needs
(we will discuss more another material in the next section).
Lastly, follow the signal stack below.
3. Make everything 50 ohms. Just in case it is your first time to
design RF PCB layout and there is no available proper tools to
simulate your design in 3D, then the best alternative that you can
try is choosing components that have a characteristic impedance of
50 ohms on RF ports. Why 50 ohm? Because 50 ohm is the best value
to do impedance matching. This includes a microstrip impedance
calculation to know it’s resistance. Moreover, you can adjust the
trace width properly to make the trace impedance on your PCB that
carries RF signals becomes 50 ohms. You can calculate the trace
width using online trace impedance calculators or microstrip
impedance calculators. You can also use a CPWG
(coplanar-waveguide-over-ground) structure to build 50Ω RF traces
on PCBs. Lastly, actually it is quite easy to find components (such
as antennas, filters, amplifiers, etc), with 50 ohms characteristic
input/output impedance, for your project.
4. Lay out RF first – ALWAYS. RF traces are the first priority that
you have to care about since it is EXTREMELY high frequency signal
carrying structures. That’s why, if you put them at last, or if you
try to put them when the board has already gotten rather clumsy,
you will make compromises with the trace layout. And it can ended
up make your design fail. Lastly, please make sure to have
sufficient space around the signal trace for smooth bends and
isolation of the RF signal.
5. Isolation is important. Isolating an RF trace is important.
Ensure to make RF traces appropriately isolated from other
high-speed signals (such as HDMI, Ethernet, USB differential pairs,
clock traces for crystals, etc). Commonly, it is employed by “via
stitching”. For example, do stitching vias around the RF trace to
prevent it from interfering with other components on board. Please
remember that inappropriate isolation will not render your design
defunct. However, it will deteriorate the receiver performance and
the average data throughtput in most cases. Therefore, utilize
isolated vias for separate parts of a filter or matching network.
6. Keep inductance low. The ground inductance can cause a huge
impact in your RF design. Grounding RF chipset through a single via
or narrow ground trace could cause a massive ground inductance. And
as we know, high-frequency does not like inductance. Therefore, do
not forget to ground the RF chipset adequately. If the RF chipset
is a QFN with ground pad, use at least 9 power vias. Then ensure a
large and continuous ground plane under the chip and RF trace as
well. If you have a free space on the top layer, do not forget to
add a ground fill that is connected to the inner ground layer
through as many vias as practically possible. But of course, don’t
add a thousand vias! It would make a lot of pains to your PCB
manufacturer. Lastly, use least number of vias in RF routing, max
number of vias in RF grounding.
7. Use Plating/Copper. Use gold plating for RF components created
from etch, with no copper inlands near the RF circuitry and no
copper thieving near the RF circuitry. Then, ground both ends of
copper pours, and stitch many vias wherever possible. The last,
separate RF planes from all other planes.
8. Routing. For routing in RF PCB design, there are some points
that you need to consider: (1) orient sensitive traces
orthogonally, (2) use short traces between the crystal and RF
device, (3) keep interconnect traces separated as much as possible,
(4) keep trace lengths to a minimum, and (5) adhere to proper
corner routing. Below are some types of corner routing.
9. Don’t break the ground plane. Maybe sometimes you find a case
when you have to design an RF system where you also have an audio
or analog circuitry on the same circuit board, and the audio or
analog circuitry is close to RF system. You may be trying to have a
different ground plane to isolate the ground for the audio or
analog part. But by doing that, you probably will make your RF
section severely. And remember that if you break the ground plane
under the RF trace, you may have a design that does not work.
Therefore, here is an example of what you should NOT do
Rogers PCB applications.
Moreover, since nowadays 5G Technology developments are growing quickly, various devices request high-frequency PCBs and RF PCBs with high performance which need not only low electrical noise but also low signal losses. And Rogers PCB material is a perfect choice to match the technological characteristics, besides it is also cost-effective for this purpose. Some Rogers PCB applications are:
1 .Automotive Radar and Sensors
2. Microwave equipment of all kinds.
3. Cellular Base Station Antennas
4. RF Identification (RFID) Tags
5. 5G Station
6. Microwave point to point (P2P) links
7. LNB’s for Direct Broadcast Satellites
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