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UV Resistant Tape Semiconductor Consumables UV Dicing Tape

Categories Semiconductor Consumables
Brand Name: CAEC
Certification: ISO9001, ISO14001, OHSAS18001
Place of Origin: Henan, China
MOQ: One piece
Price: USD 1 for one piece
Supply Ability: 50000 pieces per month
Delivery Time: 7-10 days
Packaging Details: Standard package for export
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UV Resistant Tape Semiconductor Consumables UV Dicing Tape

UV Resistant Tape


UV tape is a special tape, which has excellent adhesiveness under normal conditions. But its adhesiveness decreases rapidly after exposure of UV light. UV tape usually used as carrier tape and protective substrate during the dicing and grinding process.


UV tape is mainly composed of release film, acrylic adhesive and base film.


Main application

Semiconductor: Dicing of various types of package(BGA/QFN/DFN), wafer sawing and grinding.

Optoelectronics: Slotting, dicing and pickling of coated glass and ordinary glass.

Others: Process in which work piece should be covered when machining and uncovered after that without adhesive residue.


Main features

Excellent adhesiveness before exposed on UV light to ensure work piece fixed secure during machining process.

Low adhesiveness after exposed on UV light to make it easier to peel and prevent adhesive residue.

High expandability and easy pickup.

High performance to specific process with high temperature.


Specification:

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