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Blue Solder Mask OSP Coating PCB 4 Layer Printed Circuit Board

Categories 4 Layer PCB
Brand Name: WITGAIN PCB
Model Number: PCB0029
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
Place of Origin:: Guangdong China
Material:: FR4 TG>170
No of layers:: 4 Layer
Solder mask colour:: Blue
Surface technics:: OSP
Min Lind Space&Width:: 4/4mil
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Blue Solder Mask OSP Coating PCB 4 Layer Printed Circuit Board

4 Layer Printed Circuit Board Blue Solder Mask OSP Treatment


PCB Main Features:


1 4 Layer customized printed circuit board.

2 OSP treatment Organic Solderability Preservatives.

3 1OZ copper on each layer.

4 Blue solder mask.

5 4 Layer with very precised line width&space.

6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

7 Our product is customized product.


S1170G Material Data Sheet:


S1170G
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.24.4DMA180
TdIPC-TM-650 2.4.24.65% wt. loss390
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃210
50-260℃%2.3
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin60
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--pass
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm5.65 x 107
E-24/125MΩ.cm2.71 x 107
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.99 x 106
E-24/1254.44 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s180
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV45+kV NB
Dissipation Constant (Dk) RC52%IPC-TM-650 2.5.5.91GHz--4.4
Dissipation Factor (Df) RC52%IPC-TM-650 2.5.5.91GHz--0.01
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.3
125℃N/mm1.1
Flexural StrengthLWIPC-TM-650 2.4.4AMPa550
CWIPC-TM-650 2.4.4AMPa450
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.12
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

FAQ:


Q1: What is OSP


A1: The overall functionality of a PCB board depends upon the conductivity of copper tracks. These tracks tend to oxidize when exposed to the atmosphere, and creates problems when soldering during component placement. OSP or Organic Solderability Preservative does two things: temporarily protect exposed copper from being oxidized and improves solderability before component fixation (assembly).

OSP creates a very thin (100-4000 Angstroms) organic coating on the PCB board, which is a water-based chemical compound of ‘Azole family’ such as benzotriazoles, imidazoles, and benzimidazoles. This compound gets absorbed by the exposed copper and generates a protected film to prevent oxidization.


Advantages of OSP:

Low cost
Environment-friendly
Re-workable, but can’t take more than 2-5 rounds of reflow soldering before degradation
It is lead-free and can handle SMT components easily
It provides a coplanar surface, well suited for tight-pitch pads (BGA, QFP).


Disadvantages of OSP:

Not Good for PTH (Plated Through Holes)
Short Shelf Life, less than 6 month
Inspection is difficult as it is transparent and colorless
requires careful handling, as it’s susceptible to mechanical damage
OSP Surface Finish Process:

The OSP finishing process is composed of three major steps, including pre-cleaning and making the PCB board ready for smooth OSP coating application.



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