| Categories | On-Line AOI |
|---|---|
| Brand Name: | ZHX |
| Model Number: | ZHX-B820 |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1set |
| Price: | as negotiate |
| Payment Terms: | T/T |
| Supply Ability: | 200sets/per Month |
| Delivery Time: | 10-20days |
| Packaging Details: | Export Plywooden Case 125*110*185cm |
| Method: | On-Line In-Line |
| Application: | SMT PTH DIP Inspection |
| Inspection Items: | Paste Printing Defects,Component Defects,Solder Defects,Wave Soldering Inspect |
| Machine Dimensions(L*W*H): | 100*96*156cm |
| Weight: | About 800kg |
| Power Supply: | AC220V, 10%, Single Phase 50/60HZ, Power Consumption 1000W |
Machine Advantage
♦Germany imported 5-megapixel high-speed industrial camera and high-resolution industrial telecentric lens
♦New conveyor design, seamless butt joint can be made by connecting equipment and wave soldering
♦Support offline programming and inline debugging
♦Support central control and management, and make comprehensive judgment on test information
♦Can connect to the laser guide repair station, Integrating inspection and maintenance.
♦Belt drive, double motor design, faster transmission, can carry heavier products
♦Self-developed ultra-large R/G/B/W light source, no dead Angle irradiation 360 degrees, so that there is no place to hide bad components & solder joints
♦Full vector algorithm, fusion logic operation, for wave soldering pin, tin hole and bridge, more simple and stabl
| CATEGORY | ITEM | SPECIFICATION | |
Recognition System | Inspection | The vector image algorithms include logic operation, distance of luminance boundary, chip tracing, OCR/OCV, luminance/color template matching, color distance, color extraction (RGB & HSV), value-range of luminance, offset of luminance, the minimum variation span of luminance, etc... More than 30 kinds of the most advanced algorithms. | |
| Camera | Distal high-speed 5M Pixel camera | ||
| Lens | High-resolution Telecentric Lens | ||
| Resolution | 20 um(15um for option) | ||
| FOV | 48.96×40.96mm(20um) 36.72×30.72mm(15um) | ||
| Lamp-house | Ring tower structure ,high intensity R/G/B/W flash lighting | ||
| PCB edges | ≥3mm | ||
| Inspection mode | The image system inspect the PCB from bottom to up, can No-slot Joint with the wave soldering | ||
| Per-image Time | <300ms | ||
| Paste Printing Defects | Missing, overflow, insufficient, pasting open, stain | ||
| Component Defects | Missing, shift, skewed, tombstone, billboard, overturned, reversed polarity, wrong, damaged | ||
| Solder Defects | Overflow, insufficient, short solder, stain | ||
| Wave Soldering Inspect | Overflow, insufficient, short, Excess Solder, solder void | ||
| Inspection Items | 0201 chip (20um); 01005 chip (15um) | ||
Mechanism System | PCB Conveyor | Bottom to up clamping, Automatic PCB loading and unloading, automatic adjust the conveyor width, SMEMA standard communication protocol.The conveyor height: 900±200mm(750±20mm for option) | |
| PCB Size | 50×50mm-400×330mm | ||
| PCB Thickness | 0.5 – 5.0mm | ||
| PCB Warp Tolerance | ±2mm | ||
| Component Clearance | TOP≤70mm, BOT≤50mm | ||
| Driver | AC server, camera moves in the directions of X&Y axis. | ||
| Orientation | <10um | ||
| Moving Speed | 500mm/s | ||
Soft System | Operation System | Microsoft Windows10 | |
Characteristic | Based on the vector algorithm,integrating the Color Extraction algorithm,the Luminance Extraction algorithm and the Color Distance algorithm which can accurate analysis the components shape ,position and the solder joint ,accurate and eliminate all kinds of NG points | ||
| Operation | Graphic programming, English | ||
| Computer | Industrial Computer, Intel four-core I7 CPU, Memory:16G, Hard disk: 2TB | ||
| Display | 22 inch TFT | ||
Network | Network | NG adaptable, check and correct PCBA defects at repair station | |
| MES Support | Standard port available | ||
Other | Machine Dimensions (L×W×H) | 106×120×156cm | |
| Weight | ~980kg | ||
| Power Supply | AC220V, 10%, single phase 5A 50/60HZ, power consumption 1000W | ||
| Air Supply | 0.5MPA.70cm3/min | ||
| Working Environment | Temperature10-40℃, humidity 30-80% RH | ||
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