| Categories | PCB Assembly Services |
|---|---|
| Place of Origin: | China |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 100000pc/Month |
| Delivery Time: | 4 Weeks |
| Packaging Details: | PCB + Box |
| Brand Name: | CUSTOM MADE |
| Certification: | ISO/UL |
| Keyword: | PCB Assembly Services |
| Surface Finished: | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| PCB boards: | Thick Copper and Aluminum Boards, Rigid-flex boards |
| Applications: | Industrial Control,Medical, Automotive Electronics, Communications, Internet |
| SMT Capability: | 14 million spots per day |
| Special Capability: | Gold Finger Plating, Peelable, Carbon ink |
| Materials: | RCC,PTFE, M4,TU862, High-Tg FR4 |
| Min Laser Hole: | 0.075mm |
| Payment Method: | T/T |
| Whether to Support customization: | Support |
| Logistics: | Accept customer specified logistics |
PCB Assembly Services Flexible Boards High-Reliability Gold Finger Plating
PCB Assembly Services Description:
1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering
department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.
PCB Assembly Services Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.5-17.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Assembly Services Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.
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