| Categories | Prototype PCB Assembly |
|---|---|
| Place of Origin: | China |
| MOQ: | Negotiable |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 100000pc/Month |
| Delivery Time: | 4 Weeks |
| Packaging Details: | PCB + Box |
| Brand Name: | CUSTOM MADE |
| Certification: | ISO/UL |
| Keyword: | Prototype PCB Assembly |
| Applications: | Industrial Control, Medical care, Automotive Electronics, Communications, Interne |
| PCB Board: | POP boards, Normal Boards, FPC boards, Rigid-flex boards, Metal base boards |
| Special Capability: | Gold Finger Plating,Peelable,Carbon ink |
| SMT Lines: | 12 SMT lines |
| Surface Finished: | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp,Immersion Gold+OSP |
| Materials: | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
| Min PP Thickness: | 0.06mm |
| Payment Method: | T/T |
| Whether to Support customization: | Support |
| Logistics: | Accept customer specified logistics |
Prototype PCB Assembly Supports Rigid 12 SMT Lines 0.3 - 6.5mm Thickness
Prototype PCB Assembly Description:
1. Quick-turn prototype PCB assembly.
2. SMT/SMD assembly.
3. Thru-hole assembly.
4. Mixed Technology (SMT/Thru-hole).
5. Turn-key assembly.
6. Consignment assembly.
7. RoHS-compliant lead-free assembly / Non-RoHS assembly.
Prototype PCB Assembly Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.5-17.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Prototype PCB Assembly Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.
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