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ISO 9001 Heat Proof Jedec IC Trays Protect Chip ESD PPE MPPO Standard

Categories Jedec IC Trays
Brand Name: Hiner-pack
Model Number: Jedec standard tray 322.6*135.9*7.62&12.19mm
Certification: ISO 9001 ROHS SGS
Place of Origin: Made In China
MOQ: 500PCS
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Delivery Time: 5~8 working days
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30mm
Material: MPPO.PPE.ABS.PEI.IDP...etc
Color: Black.Red.Yellow.Green.White..etc
Temperature: 80°C~180°C
Property: ESD,Non-ESD
Flatness: less than 0.76mm
Clean Class: General and ultrasonic cleaning
Customized service: Support standard and non-standard,precision machining
Injection mold: Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)
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ISO 9001 Heat Proof Jedec IC Trays Protect Chip ESD PPE MPPO Standard

ISO 9001 Heat Proof Jedec IC Trays Protect Chip ESD PPE MPPO
ESD PPE MPPO Standard Jedec Trays With Different Cavities Can Be Customized For IC Chips
Jedec standard matrix trays or jusut Jedec trays for short are a standard-defined tray used across the entire semiconductor and microelectronics industry for transporting, handling, and storing complete chips (integrated circuits) and various other components. JEDEC trays featured fixed-size slots for placement of chips Trays are typically made of strong inflexible plastic.

The design of the structure and shape in line with Jedec international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.


The Flat cells in the center area of each tray is designed for automatic equipment to allow the use of vacuum picking up tools. If it is necessary to cancel in special cases, we can also change the design according to your requirements at the beginning of the design.


The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.


Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.


MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

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