| Categories | Hybrid PCB Board |
|---|---|
| Brand Name: | Bicheng Enterprise Limited |
| Model Number: | BIC-0328-V3.28 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD40~50 |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 5-6 working days |
| Packaging Details: | Vacuum |
| Board Material: | Polyimide (PI) 25um ITEQ 60℃ |
| Board Thickness: | 0.1mm +/-10% |
| Surface Cu thickness: | 35 um (1 oz) |
| Surface Finish: | Immersion Gold |
| Coverlay Colour: | Yellow |
| Color of Silkscreen: | White |
| Function: | 100% Pass electrical test |
Product profile
1.1 General description
This is a type of flexible printed circuit for the application of antenna. It's a single
layer board at 0.10mm thick. The base laminate is from ITEQ, It's fabricated per
IPC 6012 Class 2 using supplied Gerber data. 3M tape is applied on the back side.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Small quantity, prototypes and production.
L. Quick Lead time: 3-5 days
1.3 Application
Capacitive touch screen / panel, Flex keyboard for mobile phone
keys,
LED display soft board
1.4 Parameter and data sheet
| Number of Layers | 1 |
| Board Type | Flexbile cirucit |
| Board Thickness | 0.1mm +/-10% |
| Board Material | Polyimide (PI) 25um |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | N/A |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 um (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 1 |
| Thickness of Coverlay | 25 um |
| Stiffener | 200 um |
| 3M Tape | Yes |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Mininum Trace (mil) | N/A |
| Minimum Gap(mil) | N/A |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
1.5 Microsection Hole Wall (um)
| Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um | ||||
| NO. | A | B | C | D | E | F | AVE |
| 1 | n/a | n/a | n/a | n/a | n/a | n/a | n/a |
1.6 Outline dimension Unit: mm
| NO. | Required Dimension (toerance) | Actual dimension | ||||
| 1 | 222.00 | ±0.13 | 222.01 | 222.02 | 222.01 | 222.02 |
| 2 | 30.00 | ±0.13 | 29.99 | 30.01 | 29.99 | 30.02 |
1.7 Hole Size and Slot Dimension (mm)
| NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension | ||||
| 1 | na | na | na | na | na | na | na |
|
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