60Khz Ultrasonic Soldering Equipment Amplitude Adjustable 100 Watt

60Khz Ultrasonic Soldering Equipment Amplitude Adjustable 100 Watt Solder Glass

60Khz Ultrasonic soldering iron equipment for Soldering Copper Wire on Glass

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Description

Ultrasonic soldering is a specialized soldering process that eliminates the need for chemical flux. In place of flux, it uses acoustic energy to disrupt oxides that form on molten solder and base metal surfaces during the joining process.

Ultrasonic soldering can be done with either a specialized soldering iron or a specialized solder pot. ... Ultrasonic soldering iron tips can heat (up to 450 °C) while mechanically oscillating at 20 – 60 kHz. This soldering tip can melt solder filler metals as acoustic vibrations are induced in the molten solder pool.

Glass, ceramic, stainless steel, aluminum welding

In years of extensive research on glass-metal bonding, Japanese engineers have developed a special solder alloy called CERASOLZER (solder wire). This active solder alloy is specially formulated to cooperate with the ultrasonic welding method. It has a very unique bonding ability and can replace the commonly used silver baking, indium brazing, molybdenum manganese and resin bonding methods. CERASOLZER chemical bond (glass substrate) In addition to the direct metal-to-metal bond, Cerasolzer can also form a strong chemical bond with the welded substrate. The alloy is composed of the same main components like a standard solder alloy (lead/tin), but in addition it also contains a small amount of elements such as zinc, titanium, silicon, aluminum, beryllium, rare earths, etc. These elements have the same effect as oxygen. Very strong chemical affinity.

During the welding process, these additional elements combine with the surrounding oxygen to form an oxide, which is chemically combined with various materials, including glass, ceramics, aluminum, stainless steel, conductive oxides, and many other previously used oxides. Other substrates that are considered non-weldable. The resulting oxide is combined with the solder substrate, forming a very strong chemical bond (RO) at the interface.

Therefore, if oxygen is effectively eliminated by replacing the air around the bonding equipment with an inert gas (such as nitrogen), the adhesion of the Cerasolzer will be lost. The results show that the appropriate critical oxygen concentration for bonding is about 2%. The melting temperature of Cerasolzer alloy is between 155 and 297℃. Due to ultrasonic vibration, the welding method is flux-free. In fact, if our ultrasonic welding method uses flux, it will destroy the oxygen bond and destroy the entire welding process, so it should not be used.

Basic welding method

1. Two-step method (pre-welding + bonding)
In the first step, using high temperature and ultrasonic vibration, the Cerasolzer is sent to the tip of the ultrasonic soldering iron and coated on the substrate (glass, etc.). Then use ordinary solder or preferably Cerasolzer to solder metal fittings, wires, strips, etc. in the pre-soldering zone.

2. One-step method (direct welding)
When Cerasolzer is sandwiched in the gap between metal and glass, ceramic or metal oxide, ultrasonic vibrations directly act on the metal. The bonding is completed in a short time. This method provides slightly lower performance than the previous method.

3. Dipping method
The dipping method is an ideal method for large-scale surface coating. Cerasolzer solder is melted in a special soldering pot with an ultrasonic vibrator. When the surface of the soft solder is corrugated due to ultrasonic vibration, immerse the coated part in water. Ultrasonic dip soldering equipment is recommended.