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5.8G Video Transmitter QCA6174A Mini Pcie Module Support 802.11ac Bluetooth 5.0

Categories PCIe WiFi Module
Brand Name: FN-LINK
Model Number: F6174PM13-W1
Certification: ROHS/REACH
Place of Origin: China
MOQ: 5/pcs
Price: USD6.5-8.8/pcs
Payment Terms: T/T
Supply Ability: 4000000pcs/month
Delivery Time: 15-40 workdays
Packaging Details: Reel
Product: Qualcomm WiFi Module
Type: WiFi Bluetooth Combo Module
Wireless Standard: IEEE802.11a/b/g/n/ac+Bluetooth 5.0
Demension: 26.2x23.0x1.8mm
Packing: 600pcs/Roll
Sample: Contact Us
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5.8G Video Transmitter QCA6174A Mini Pcie Module Support 802.11ac Bluetooth 5.0

5.8G Video Transmitter QCA6174A Qualcomm WiFi Module Support 802.11ac+Bluetooth 5.0

Key Features

1.Support 802.11b/g/n/ac 2T2R WLAN and Bluetooth

2.Operation at 2.4~2.5GHz and 5.15~5.825GHz frequency band

3.Provides simple legacy and 20MHz/40MHz/80MHz co-existence mechanisms to ensure backward and network compatibility

4.Supports infrastructure networks via Access Point and ad-hoc network via peer-to-peer communication

5.Supports IEEE 802.11i(WPA and WPA2). Open, shared key, and pair-wise key authentication services

6.Bluetooth 5.0 compliant

7.Bluetooth Low Energy Support

8.Supports AFH to dynamically detect channel quality to improve transmission quality

Introduction

It is based on Qualcomm QCA6174 chipset.

It complied with IEEE802.11a/b/g/n/ac, and it can be used to provide up to 54Mbps for IEEE 802.11a and IEEE 802.11g,11Mbps for IEEE 802.11b, 300Mbps for IEEE 802.11n (2T2R), and 866.7Mbps for IEEE 802.11ac.

It supports BT2.1+EDR/BT3.0+HS and BT4.2 and BT5.0.

It is a highly integrated module 802.11a/b/g/n/ac 2T2R USB2.0 WLAN controller.

It provides a complete solution for a high throughput performance integrated wireless LAN and Bluetooth device.

Specs

Main ChipsetQCA6174
InterfacePCIe/Uart
Data Rate867Mbps
RF AntennaExternal Antenna
Frequency2.4GHz/5.8GHz
Size26.2x23.0x1.8mm
Power Supply3.3V
OS SupportedLinux/Android
Operating Temperature0° C to 70°C
Storage Temperature-40° C to 80°C

Block Diagram

Moisture Sensitivity

The Modules is a Moisture Sensitive Device level 3, in according with standard
IPC/JEDEC J-STD-020, take care
all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity
(RH).
b) Environmental condition during the production: 30 ° C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process
must be 168 hours if condition
b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more

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