Categories | Ultrasonic Soldering Equipment |
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Brand Name: | RPS-SONIC |
Model Number: | RPS-DS20 |
Certification: | CE |
Place of Origin: | China |
MOQ: | 1set |
Price: | negotiation |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 200 SETS PER MONTH |
Delivery Time: | 3DAYS |
Packaging Details: | FOAM AND CARTON |
Frequency: | 20Khz |
Power: | 1000w |
Type: | Digital generator |
Application: | Cooper Tinning |
Temperature Range: | 200~400 °C |
Horn: | alloy steel |
Ultrasonic Soldering Machine ( Dip Soldering Type ) offers highly solid and reliable soldering joints without flux.
The Solbraze Ultrasonic Soldering System makes possible the dip tinning of a wide range of both metallic and non-metallic materials without the use of any flux.
The Ultrasonic Solder Pot is a self contained soldering systems. The high-powered ultrasonic tank provides rapid removal of surface oxides located on the immersed component. Intense cavitation implosions etch through surface oxides exposing a layer of clean base material. The soldering alloy rapidly wets the clean surface providing a uniform bond with superior performance.
Fluxless Soldering of Wire Using Ultrasonic Energy
We have mastered the technique for Fluxless Soldering of Stranded
or Braided Wire. Our typical Ultrasonic Soldering Pot has the
ultrasonic energy source originating from the bottom of the molten
solder. Our Wire Tinning System has the ultrasonic energy source
located on the sidewalls of the Soldering Chamber, thus delivering
more ultrasonic energy to the location requiring the ultrasonic
energy. This new technique allows us to solder components that just
could not be soldered before.
Benefits provided by Ultrasonic Soldering Include:
Ultrasonic Soldering maximizes the effectveness of many joint designs. Sometimes flux is necessary due to the base materials chosen. Ultrasonic Soldering allows for a reduction in the chemical strength of the required flux while improving overall performance.
Features:
Parameter:
Characteristics
Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.
No need for flux
Reliable bonding/sealing
Best used in difficult, small-surface places with limited access
Application coating on:
Aluminum components
Ferrite components
Glass components
Silicon wafers
Ceramic components
Semiconductor chips
Metals etc.
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