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ITEQ FR4 Material Heavy Copper PCB Precision Fabrication for Intelligent Robot

Categories Heavy Copper PCB
Brand Name: ACCPCB
Model Number: P1030
Certification: ISO, UL, SGS,TS16949
Place of Origin: China
MOQ: 1 PCS
Price: Negotiable
Payment Terms: L/C, T/T, Western Union,Paypal
Supply Ability: 30000SQ.M/Per Month
Delivery Time: 10-15days
Packaging Details: Vacuum packing with desiccant
Material: ITEQ FR4
Application: pcb copper sheet Heavy Copper PCB for intelligent robot motherboard
Cooper thickness: 2 oz each layer
Board thickness: 2.4 0mm
Surface Finish: Immersion Gold
Feature: Rigid Circuit Boards
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ITEQ FR4 Material Heavy Copper PCB Precision Fabrication for Intelligent Robot

ITEQ FR4 Material Heavy Copper PCB Precision Fabrication for Intelligent Robot


Key Specifications/Special Features:

Layer : 4 Layers

Base Material : ITEQ FR4
Copper Thickness : 2 oz in all layer
Board Thickness : 2.20 mm
Min. Hole Size : 8 mil / 0.2 mm
Min. Line Width : 4 / 4 mil
Min. Line Spacing : 4 / 4 mil
Surface Finishing : Immersion gold ( au :2micron)

Fire-proof level : 94v0

Solder mask : Black

Certificate : UL, CQC, TS16949, ISO14000, ROHS


Technology Capability:

ItemTechnical Parameters
Layers1-28 Layers
Inner Layer Min Trace/Space4/4 mil
Out Layer Min Trace,Space4/4 mil
Inner Layer Max Copper4 OZ
Out Layer Max Copper4 OZ
Inner Layer Min Copper1/3 oz
Out Layer Min Copper1/3 oz
Min hole size0.15 mm
Max.board thickness6 mm
Min.board thickness0.2mm
Max.board size680*1200 mm
PTH Tolerance+/-0.075mm
NPTH Tolerance+/-0.05mm
Countersink Tolerance+/-0.15mm
Board Thickness Tolerance+/-10%
Min BGA7mil
Min SMT7*10 mil
Solder mask bridge4 mil
Solder mask colorWhite,black,blue,green,yellow,red,etc
Legend colorWhite,black,yellow,gray,etc
Surface finishHAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materialsFR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control+/-10%
Bow and twist≤0.5

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;



Quality Goal:

CategoryPerformance indicatorQuality Goal
DeliveryCustomer service rate99.9%
Semi Finished productProcess inspection pass rate100%
Finished productFQA Rebate rate0.1%
Scrapped1L scrap rate0.5%
2L scrap rate1%
Multi Layer scrap rate2%
CustomersCustomer complaint rate0.8%
Customer return rate0.5%
Customer satisfaction99%

FAQ

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;


Product Tags:

copper base pcb

  

copper core pcb

  
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