Multilayer Rigid Flex PCB Design Impedance Controlled 1.6Mm Pcb
JXE provides comprehensive engineering and manufacturing
specializing in flexible interconnect systems.
From our inception, we have been dedicated to developing innovative
high-density interconnect solutions for all electronics industries.
JXE has the expertise to provide design, documentation, procurement
and supply chain management with specialized added value services
Laser Services and Plasma Cleaning
Steel Rule Die Outlining
Class A Die Outlining
Folding, Wrapping, Forming
Silver Shielding (360 Degree Coverage)
Marking and Labeling
1. Soldermask ink as soldermask layer, including Black, Red, Yellow
and Green. Among then, Black one could be also used Black PI
2. FCCL material. Rolled Anneal Copper. But you could change it
into Elctro-deposited copper.
3. Strong singal quality.
4. Excellence elctronic property and reliable dielectric
5. Increased the reliablity in circuitry system.
6. Lighter weight than PCB, reduce the weight of final products.
7. High heat resisting property, in favor of increasing heart
8. Immersion Nickel Gold. Please note that it is not pure gold.
Nickel could assist the gold to hard without adding more gold
9. Strong signal quality.
10.Widely used as chip of SIM cards and Smart IC card.
11. Materials thinkness. 18um copper, 25um PI, and 20um adhesive on
FCCL, 12.5um PI and 15um adhesive on PI coverlay film. More options
please view the below parameter lists.
|Specification of standard Polyimide film based coverlay|
|Specification||PI Flim Thickness (um)||Adhesive Thickness (um)|
|Specification of standard Haloger-free PI film based flexible
copper clad laminate (3- layer FCCL)|
|Specification||Materials Thickness (um)|
|PI:Copper||PI Film||Copper Foil||Adhesive|
|0.5 mil:0.5 OZ||12.5||18||13|
|1 mil:0.5 OZ||25||18||20|
|1 mil:1 OZ||25||35||20|
|2 mil:1 OZ||50||35||20|
Shinelink Company has been an industry leading FPC manufacturer
Main Products, Flex PCB (Flexible printed circuit), Rigid-Flex PCB
1. More than 12 years manufacturing experience in FPC field.
2. Focus on FPC this only product.No PCB production line.
3. Near 12000 square meters production base.
4. Caple technical personelconsist of some industry experts and
elites who are working for more than 10 years in FPC field.
5. Many advanced and complete production equipments for FPC
6. All manufacturing process is only made in our plant.
7. Through the professional training, our sales team could offer
the clients with the quick answer to the technology question, and
the most professional suggestion on the optimization of artwork
design. It would help to better improve the project rationality and
decrease the production cost, thereby providing with the best
cost-effective process plan.
8. All the raw materials passed ROHS certification through SGS and
flammability UL94 V-0,inculding FCCL and Polyimide Coverlay Film.
FPC Process Capability
|Items||FPC Process Capability|
|Number of Layers||Single Sided, Double Sided, Multilayer, Rigid-flex PCB|
|Based Material||PI, PET|
|Largest Board Area||406mm X 610mm/16"X 24",The largest could be 7 meters length in
Single sided Flexible Printed Circuit Board|
|Minimum Hole Diameter of Mechanical Drilling||0.2mm/0.008"|
|Minimum Hole Diameter of Laser Drilling||0.075mm/0.03"|
|Minimum Hole Diameter of Hole-punching||0.50mm/0.02"|
|Tolerance of Plated Through Hole||+/-0.05mm/±0.02"|
|Minimum Line Width||0.075mm/0.003"|
|Minimum Line Spacing||0.075mm/0.003"|
|Peel Strength||1.2kg f/cm|
|Shape Processing||Die Stamping, Cutting, Laser Prototyping|
|Appearance of Tolerance||+/-0.05mm/ +/-0.02"|
|Solder Mask Type||PI Solder Mask Coverlay Film or PET Solder Mask Covelay Film
|Multi-colored Liquid Photo-Imageable solder Mask Ink, Thermosetting
Solder Mask Ink|
|Surface Treatment||Plating Tin, Immersion Tin, Plating Nickel Gold, ENIG (Electroless
Nickel Immersion Gold),Immersion Nickel Gold, Chemical Nickel
Gold,OSP( Organic Solderability Preservatives), Immersion Silver|
Only focus on FPC manufacturing, Professional FPC technology.
1. OEM services provided, Product and Package
2. Sample order is acceptable ,the order quantity is unrestricted.
3. Response to your inquiry within 24 hours.
4. After sending, we will track the products for you once every two
days, until you get the products.
5. Professional sales team could answer any technical question at
fastest speed and help you to solve any problem on design.
6. Supply the professional suggestion on design and usage.
1. Higher circuit density
2. Decreased Assembly Time and Costs.
3. Increased Heat Dissipation
4. A multi-layer flex circuit combines several single-sided or
double-sided circuits with complex interconnections, shielding
and/or surface mounted technologies in a multi-layer design.
5. Several copper layers separated encapsulated by dielectric
layers. Metal layers are often connected by metalized thru-holes
6. The surface treatment is mostly ENIG, but it is acceptable for
Plating Nickel-Gold, Plating Tin, Immersion Tin and OSP.
7. The multilayers may or may not be continuously laminated
together throughout the production process. If your design needs
require maximum flexibility, continuous lamination may not be
Packing and Delivery
1. Firstly hermetic plastic bag fill with products,
2. Then bubble sheet separates them,
3. Finally paper carton packing.
1. It would take 7-9 days to mufacture it after deposit
received.Production time would depend on your drawing and process
2. DHL,FedEx, UPS delivery. It is faster than vessel.Barely
deliever it by vessel.