BGA Rework Equipment ZM-R5860C Main Features
1 BGA Rework Equipment ZM-R5860C adopt liner slide which makes XYZ
axis all can do precision adjustment or fast positioning, with high
positioning accuracy and fast maneuverability.
2 BGA Rework Equipment ZM-R5860C is of high definition touch screen
(Taiwan), PCL control, can save multiple groups profile, password
protection and modify function, and can save multiple groups
profile, equipped with instant temperature curve analysis function.
3There are 3 independent heating areas from top to bottom. The 1st
and 2nd are hot-air heaters, the 3rd is IR preheating, temperature
controlled within ± 3 ° . Top heater can be adjusted freely, second
heater can be adjusted up and down, and the top and the bottom
temperature can control many groups and sections of temperature
parameters at the same time. The power consumption of the third IR
heater can be adjusted.
4 BGA Rework Equipment ZM-R5860C Offer all kinds of hot-air nozzle,
it can rotate 360° C. With magnet, easy to install and change,
customized is available. Bottom IR heater ensure an even heat for
5 Choose imported high-precision K-type thermocouple, closed loop
control and automatic temperature compensation system, combined PLC
module for the precision control of temperature.
6. BGA Rework Equipment ZM-R5860C use a V-groove equipped with a
flexible fixture for PCB positioning to protect the PCB from
deformation when heated or cooled, and it can rework for any BGA
7 BGA Rework Equipment ZM-R5860C's powerful cross-flow fan rapidly
cool the PCB board to improve efficiency. Also built-in vacuum pump
and external vacuum suction pen, pick up the chips rapidly.
8. After finish desoldering & soldering, there is an alarming
and alarming in advance.
9BGA Rework Equipment ZM-R5860C is of CE certificate, with
emergency stop and Automatic power-off protection device when
abnormal accident happens, with a double over-heating protection
10BGA Rework Equipment ZM-R5860C is of CCD vision system, accurate
judgments on the melting process during the BGA soldering and
desoldering, provide critical vision. &
|3||Bottom heater||2nd heater 1200W, 3rd IR heater 2700W|
|4||Power supply||AC220V± 10 50/60Hz|
|5||dimension||635× 600× 560mm|
|6||Positioning||V-groove, PCB support can be adjusted in any direction with
external universal fixture|
|7||Temperature control||(K Sensor) closed loop, independent heating, precision within ± 3°
|8||PCB size||Max 410× 370mmMin 20× 20 mm|
|9||Electrical selection||Highly sensitive temperature control module+Touch screen