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BGA Rework Equipment with Camera and Monitor (ZM-R5860C)

Categories Passive Components
Packaging Details: Standard Wooden Packing
Function: Repair VGA Cards, South, North Bridge, CPU, LCD TV
Place of Origin: Shenzhen,
Color: Black
Brand Name: Seamark ZM
Model Number: ZM-R5860C
Production Capacity: 200sets/ Month
Heating: Infrared and Hot Air
Standard: CE
Main Markets: Global
HS Code: 8515800090
Category: Double-Sided PCB
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BGA Rework Equipment with Camera and Monitor (ZM-R5860C)

BGA Rework Equipment ZM-R5860C Main Features
1 BGA Rework Equipment ZM-R5860C adopt liner slide which makes XYZ axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability.
2 BGA Rework Equipment ZM-R5860C is of high definition touch screen (Taiwan), PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function.
3There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within ± 3 ° . Top heater can be adjusted freely, second heater can be adjusted up and down, and the top and the bottom temperature can control many groups and sections of temperature parameters at the same time. The power consumption of the third IR heater can be adjusted.
4 BGA Rework Equipment ZM-R5860C Offer all kinds of hot-air nozzle, it can rotate 360° C. With magnet, easy to install and change, customized is available. Bottom IR heater ensure an even heat for PCB board.
5 Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.
6. BGA Rework Equipment ZM-R5860C use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.
7 BGA Rework Equipment ZM-R5860C's powerful cross-flow fan rapidly cool the PCB board to improve efficiency. Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.
8. After finish desoldering & soldering, there is an alarming and alarming in advance.
9BGA Rework Equipment ZM-R5860C is of CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens, with a double over-heating protection control.
10BGA Rework Equipment ZM-R5860C is of CCD vision system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision. &
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1Total Power4700W
2Top heater800W
3Bottom heater2nd heater 1200W, 3rd IR heater 2700W
4Power supplyAC220V± 10        50/60Hz
5dimension635× 600× 560mm
6PositioningV-groove, PCB support can be adjusted in any direction with external universal fixture
7Temperature control(K Sensor) closed loop, independent heating, precision within ± 3° c.
8PCB sizeMax 410× 370mmMin 20× 20 mm
9Electrical selectionHighly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC
10Weight40kg
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