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Signal Integrity Pogo Pin IC Decapsulator(IC)

Country/Region china
Company Fantron Technologies(Shanghai) Co.,Ltd
Categories Signal Switch IC
Telephone 65-96853087, 65-67418318, 86-21-62773627, 62773067, 86-21-62771271, 86-20-37598797, 37598951, 86-20-37598795
ICP License Issued by the Chinese Ministry
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Signal Integrity Pogo Pin IC Decapsulator(IC)


IC ELITE ETCH AutomatedDual Acid Decapsulator
IC、(IC)FPD(Flat Panel Display )

Features:
- Single piece Silicon Carbide etch head/etch plate
- Accurate Temperature Control
- Real time etch time adjustment
- Real time acid mixing
- High maximum etch temperature
- Post etch cooling of waste acids permitting safe use of a single waste bottle
- Separate, hand held controller for remote operation
- Automatic bottle sealing
- Large etch head
- Low contained volumes of acid
- SEMI S2000 and CE Mark conformance
Benefits:
- Consistently reproducible results
- High sample throughput for maximum productivity
- Fast temperature rise and cool times
- Fast etch times
- Wide range of package decapsulation 
- Controllable re-etching capabilities via real time etching period adjustment
- Reduced fume generation 
- Wide range of operating temperatures

ELITE ETCH SYSTEM SPECIFICATON
GENERAL SPECIFICATION
Dimensions - (W x D x H)
Decapsulator7.5 x 12.5 x 12 inch (190 x 318 x 305 mm)
Bottle Assembly10 x 5 x 11 inch (254 x127 x 279 mm)
Weightapprox. 35 lbs.(16 Kg)
Power Source90~250 VAC
Acid temp. range20~250℃
Acid temp. set point1.00.1℃
Etch cavity (up to)22 x 22 mm
SOFTWARE OPERATIONAL SPECIFICATION
Choice of acid selectionfuming sulfuric acid
fuming nitric acids
mixed acids
NOTE: All mix ratios are dynamically prepared within pumping assembly
Acid mix ratios(nitric to sulfuric ratios)9:1, 5:1, 4:1, 3:1, 2:1, 1:1
Post etch rinse optionsfuming sulfuric acid
fuming nitiric acid
mixed acids
no rinse
NOTE: Acid rinse temperature setttings are automatically calibrated
to optimum etch temperatures.
Etch times1 to 1,800 seconds (1 sec. increments)
Dynamic (real time) adjustment of etch time
Etch modalitiesPulse Etch, Reciprocal Etch Acid Pulse (REAP)
NOTE: REAP is a superior approach to maximizing the carrying capacity for the etch acid(s) within the package volume. It allows superior etch characteristics when nitric acid or mixed acids are selected.
Etch temperature ranges20 to 90℃ (nitric acid)
20 to 250℃ (sulfuric acid)
20 to 100℃ (mixed acids)
Etchant acid volume selection1 to 6 ml. per minute for all acids and acid mixes
Operator program storage100 programs stored to nonvolatile memory
Software upgradesvia RS 232 computer link
SAFETY DESIGN FEATURES
EMO Emergency Power Off switch
Etch head safetyover temperature sensor circuitry
Leak detection sensorsin Decapsulator Body
in Bottle Box Assembly
Secondary containmentTrue Secondary Containment
Acid fume reductionWaste acid heat exchanger to minimize acid fuming
CERTIFICATIONS & INDUSTRY COMPLIANCE
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