These above indicators at home and abroad are epoxy molding
compounds for the GM industry standards, customers can also order
low-softening , low viscosity value of the product .
Use: E-grade phenolic resin of the phenol formaldehyde condensation
from the high purity of linear thermal plastic phenolic resin,
epoxy molding material is hardening agent, is the general upgrading
of the 2132 resin products. Adaptation in the electronics,
electrical appliances, aerospace and other industries, is a new
type of phenolic resin; products are widely used in glass fiber
reinforced plastics, phenolic laminate, phenolic-plastics,
integrated circuits Electric and Electronic Devices molding, a
special heat-resistant insulation materials and civilian Electrical
appliances, and so on.
Packaging: The net weight is 20 kg,use the paper models Compound
Bags, lined with plastic bags.
Storage and transport: The goods should be stored in dry and
ventilatoty warehouse , during the transportion, stop raining from
being exposed to moisture. Llight handling and stacking to prevent
the packaging from damaging, when they are stored, separate storage
from toxic substances.